Solid-state image pickup device

ABSTRACT

In a rear surface incidence type CMOS image sensor having a wiring layer  720  on a first surface (front surface) of an epitaxial substrate  710  in which a photodiode, a reading circuit (an n-type region  750  and an n+ type region  760 ) and the like are disposed, and a light receiving plane in a second surface (rear surface), the photodiode and a P-type well region  740  on the periphery of the photodiode are disposed in a layer structure that does not reach the rear surface (light receiving surface) of the substrate, and an electric field is formed within the substrate  710  to properly lead electrons entering from the rear surface (light receiving surface) of the substrate to the photodiode. The electric field is realized by providing a concentration gradient in a direction of depth of the epitaxial substrate  710 . Alternatively, the electric field can be realized by providing a rear-surface electrode  810  or  840  for sending a current.

The subject matter of application Ser. No. 10/440,683 is incorporatedherein by reference. The present application is a Divisional of U.S.Ser. No. 10/440,683, filed May 19, 2003, now U.S. Pat. No. 7,701,029,issued Apr. 20, 2010, which claims priority to previously filed Japanesepatent application number P2002-144886 filed on May 20, 2002, in JAPANwhich is incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates generally to a solid-state image pickupdevice for use as various image sensors and camera modules.

DESCRIPTION OF THE RELATED ART

Recently, video cameras and electronic cameras have achieved tremendouscommercial success. These cameras typically use a CCD type or anamplification type solid-state image pickup device.

Of the conventional solid-state image pickup devices, the amplificationtype solid-state image pickup device (CMOS image sensor) includes, on asingle semiconductor chip, an image pickup pixel unit formed byarranging a plurality of pixels two-dimensionally and a peripheralcircuit unit disposed on the outside of the image pickup pixel unit.

Each of the pixels of the image pickup pixel unit includes an FD partand various MOS transistors for transfer, amplification and the like. Aphotodiode receives light incident on each pixel and performsphotoelectric conversion to thereby generate signal charge. The transfertransistor transfers the signal charge to the FD part. The amplificationtransistor detects variation in potential of the FD part,

and then converts and amplifies the variation in potential of the FDpart into an electric signal. Thereby the signal of each pixel is outputthrough a signal line to the peripheral circuit unit.

The peripheral circuit unit includes: a signal processing circuit forsubjecting the pixel signal from the image pickup pixel unit topredetermined signal processing such for example as CDS (CorrelatedDouble Sampling), gain control, A/D conversion and the like; and adriving control circuit for driving each of the pixels of the imagepickup pixel unit and controlling the output of the pixel signal, suchas, for example, a vertical and a horizontal scanner and a timinggenerator (TG).

FIG. 11 is a sectional view of a device structure in a conventional CMOSimage sensor, showing the structure of one pixel 10 of the image pickuppixel unit and one MOS transistor 20 provided in the peripheral circuitunit.

The pixel 10 of the image pickup pixel unit has a P-type well region 11on an N-type silicon substrate 1, and a photodiode 12 and an FD part 13in the P-type well region 11. An upper insulating layer 2 on the N-typesilicon substrate 1 includes: a polysilicon transfer electrode 14 for atransfer gate for transferring signal charge from the photodiode 12 tothe FD part 13; metal wiring 15 and 16 of aluminum or the like in ahigher layer than that of the polysilicon transfer electrode 14; and alight shield film 17 having an opening for the photodiode 12 to receivelight in a layer higher than that of the metal wiring 15 and 16.

A passivation film 3 formed by a silicon nitride film or the like isprovided on the upper insulating layer 2, and an on-chip color filter 18and an on-chip microlens 19 are provided on the passivation film 3.

The MOS transistor 20 of the peripheral circuit unit has a P-type wellregion 21 on the N-type silicon substrate 1, and a source region 22 anda drain region 23 in the P-type well region 21. The upper insulatinglayer 2 on the N-type silicon substrate 1 includes: a polysilicon gateelectrode 24 of the MOS transistor 20; metal wiring 25, 26, and 27 ofaluminum or the like in a higher layer than that of the polysilicon gateelectrode 24; and metal wiring 28 of aluminum or the like in thepassivation film 3 higher than that of the metal wiring 25, 26, and 27.

In each pixel of the solid-state image pickup device with such acomposition, for a higher aperture ratio of the photodiode 12 (ratio oflight incident on the photodiode 12 to light incident on the pixel), themicrolens 19 condenses incident light on the photodiode 12 through aspace between the pieces of wiring.

In this case, however, a part of the light condensed by the microlens 19is reflected by the wiring 15 and 16. This causes the followingproblems.

1) The reflection by the wiring of the part of the light condensed bythe microlens 19 correspondingly lowers sensitivity.

2) A part of the light reflected by the wiring enters a photodiode of anadjacent pixel, resulting in color mixing.

3) Since wiring layout is limited, limitations in that wiring cannot beplaced over the photodiode or thick wiring cannot be routed degradecharacteristics.

4) Size reduction is difficult for the same reason as in 3).

5) Light obliquely enters a pixel in a peripheral portion and istherefore reflected at a higher rate, resulting in darker shading in theperipheral portion.

6) When the CMOS image sensor is to be produced by an advanced CMOSprocess involving more wiring layers, a distance from the microlens tothe photodiode is increased, which aggravates the difficulties asdescribed above.

7) As a result of 6), a library of the advanced CMOS processes cannot beutilized. Laying out again of circuits registered in the library,increase in area due to limitations on the wiring layers or the likeresults in increased cost. Also, pixel area per pixel is increased.

In addition, when light of long wavelength such as red light issubjected to photoelectric conversion in the P-type well region 11 at aposition deeper than that of the photodiode 12, resulting electronsdiffuse in the P-type well region 11 and then enter a photodiode 12 in adifferent position, thus causing color mixing. When the electrons entera pixel shielded from light for black detection, a black level iserroneously detected.

Furthermore, there is a process using silicide in the active region.Since silicide blocks incidence of light, it is necessary to add aprocess of removing only silicide over the photodiode 12. This increasesand complicates process steps. A defect in the photodiode is also causedby the process steps.

As described above, the peripheral circuit unit of the CMOS image sensorhas functions of a camera signal processing circuit, a DSP and the like,which have previously been formed on a different chip. As their processgeneration is advanced from 0.4 ,,m to 0.25 ,,m to 0.18 ,,m to 0.13 ,,m,if the CMOS image sensor itself is not adapted to these new processes,the benefits of the finer processes cannot be gained, and abundant CMOScircuit libraries and IPs cannot be used.

With the advance of the process generation, however, the layers of thewiring structure have been increased in number. For example, the 0.4,,mprocess uses three layers of wiring, whereas the 0.13,,m process useseight layers of wiring. Also, thickness of the wiring is increased, andhence the distance from the microlens to the light receiving plane ofthe photodiode is increased three to five times.

Thus, with the conventional method of passing light through wiringlayers to the light receiving plane, light cannot be condensed on thelight receiving plane of the pixel efficiently, and the problems of 1)to 7) are more noticeable.

Accordingly, in view of the conventional problems as described above,the present applicant has proposed a method of fabricating a solid-stateimage pickup device applicable to a rear surface incidence type CMOSimage sensor (see Japanese Patent Application No. 2002-76081, forexample). According to this proposition (hereinafter referred to as aprior application), a wiring layer is provided on a first surface (frontsurface) of a semiconductor substrate in which a photodiode as an imagepickup element and the like are disposed, and a light receiving plane ofthe photodiode is provided in a second surface (rear surface).

A constitution of the solid-state image pickup device according to theprior application will now be described.

FIG. 12 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to the prior application,showing a structure of one pixel 400 of an image pickup pixel unit andone MOS transistor 500 provided in a peripheral circuit unit. In FIG.12, an upper part is an incidence plane (rear surface) side and a lowerpart is a wiring plane (front surface) side.

The CMOS image sensor has three layers of metal wiring 330, 340, and 350as described above within a silicon oxide film layer 610, which isprovided on a substrate supporting material (glass resin or the like)600. A silicon layer (N-type silicon substrate) 620 provided on thesilicon oxide film layer 610 includes the pixel 400 and the MOStransistor 500 described above.

The pixel 400 is formed by providing a photodiode 420 in a state ofpenetrating the silicon layer 620 at a portion intermediate betweenP-type well regions 410A and 410B formed in a state of penetrating thesilicon layer 620. An FD part 210 as described above is provided in oneP-type well region 410A. A transfer gate electrode 312 as describedabove is provided within the silicon oxide film layer 610 at a positionintermediate between the photodiode 420 and the FD part 210.

The MOS transistor 500 is formed by providing a P-type well region 510in a region of the N-type silicon layer 620 on the side of the siliconoxide film layer 610, providing a source/drain (S/D) 520A and 520B inthe P-type well region 510, and providing a gate electrode (polysiliconfilm) 530 on a side of the silicon oxide film layer 610.

A P+ type region 630 is provided on the N-type silicon layer 620, and asilicon oxide film (SiO2) 640 is provided on the P+ type region 630.Further, a light shield film 650 of aluminum or the like is provided onthe silicon oxide film 640. The light shield film 650 has an opening650A corresponding to a light receiving region of the photodiode 420.

Though not shown, a pixel for detecting a black level is formed in adevice structure similar to that of the pixel 400 shown in FIG. 12.However, the opening 650A of the light shield film 650 is not formed ina light receiving region of the pixel for detecting a black level. Thusthe pixel outputs signal charge as a black level reference signalwithout receiving light.

A silicon nitride film (SiN) 660 as a passivation layer is provided onthe light shield film 650. Further, on the silicon nitride film 660, acolor filter 670 and a microlens 680 are disposed in an on-chipstructure in a region corresponding to the image pickup pixel unit.

A wafer forming such a CMOS image sensor is polished by CMP (ChemicalMechanical Polishing) so that the silicon layer 620 has a film thicknessof about 10 ,,m, for example.

From a viewpoint of light frequency characteristics, desirable filmthickness ranges from 5 ,,m to 15 ,,m for visible light, from 15 ,,m to50 ,,m for infrared light, and from 3 ,,m to 7 ,,m for an ultravioletregion.

Unlike wiring, the light shield film 650 can be laid out with onlyoptical factors being considered. Only the light shield film 650 forms ametal layer in a region from the microlens 680 to the photodiode 420. Inaddition, height of the light shield film 650 from the photodiode 420 islow at about 0.5 ,,m, for example, which is thickness of the siliconoxide film 640. Hence, unlike the foregoing conventional example,limitation on light condensation due to reflection by metal wiring canbe eliminated.

In such a solid-state image pickup device, a light receiving surface ofthe photodiode is formed by polishing the rear surface side of thesemiconductor substrate. In this case, it is desirable that the P-typewell regions where each device of the image pickup pixel unit is formedreach the polished rear surface of the semiconductor substrate and thatthere be no P-type well region under (on the light receiving surfaceside) of the photodiode.

For stable polishing of the semiconductor, however, a thickness of 10,,m or more including a margin is desirable. Also from a viewpoint ofsensitivity to red light, a substrate thickness on this order isdesirable.

Thus, as shown in FIG. 12, for example, the P-type well regions 410A and410B need to be formed in a state of penetrating the silicon layer 620having a film thickness of 10 ,,m or more. However, the forming of theP-type well regions to a depth of 10 ,,m or more in the semiconductorsubstrate has a problem in that it requires advanced fabricationtechnology.

There is also a demand for a smaller area a few ,,m square or less forthe photodiode in correspondence with smaller size of the image pickupdevice chip. In this case, the photodiode becomes very long and narrowin a direction of depth of the semiconductor substrate, thus requiring aprocess of forming a longer and narrower photodiode 420 as shown in FIG.12, for example. Therefore advanced fabrication technology is requiredalso in this case.

Incidentally, even when the P-type well regions of the image pickuppixel unit are formed so as not to reach the rear surface side of thesemiconductor substrate, operation itself of the solid-state imagepickup device is possible. However, electrons generated by photoelectricconversion in a shallow region on incidence of light on the rear surfaceof the semiconductor substrate, for example, do not necessarily enterthe nearest photodiode, diffusing and entering another photodiode. Thiscauses problems of color mixing and decrease in resolution.

It is accordingly one object of the present invention to provide asolid-state image pickup device and a method of fabricating the samethat make it possible to prevent color mixing and decrease in resolutionwhile ensuring stable fabrication by using a shallow P-type well regionin a rear surface incidence type solid-state image pickup device. Otherobjects and advantages of the present invention will be apparent inlight of the following Summary and Detailed Description thereof.

SUMMARY OF THE INVENTION

In order to achieve the above object, according to the presentinvention, there is provided a solid-state image pickup devicecharacterized by comprising: a semiconductor substrate having an imagepickup pixel unit formed by arranging a plurality of pixels eachincluding a photoelectric converting device and a reading circuittherefor in a two-dimensional array; a wiring layer formed by stacking aplurality of layers of wiring including a signal line for driving theimage pickup pixel unit on a first surface of the semiconductorsubstrate, a second surface of the semiconductor substrate being formedas a light receiving plane for the photoelectric converting device; andelectric field generating means for generating an electric field in thesemiconductor substrate in a direction of depth of the semiconductorsubstrate and thereby leading photoelectrons entering from the lightreceiving plane of the semiconductor substrate to the photoelectricconverting device formed on a first surface side of the semiconductorsubstrate.

Further, according to the present invention, there is provided a methodof fabricating a solid-state image pickup device, the solid-state imagepickup device including: a semiconductor substrate having an imagepickup pixel unit formed by arranging a plurality of pixels eachincluding a photoelectric converting device and a reading circuittherefor in a two-dimensional array; and a wiring layer formed bystacking a plurality of layers of wiring including a signal line fordriving the image pickup pixel unit on a first surface of thesemiconductor substrate, a second surface of the semiconductor substratebeing formed as a light receiving plane for the photoelectric convertingdevice, the method characterized by comprising: a substrate forming stepfor providing electric field generating means for generating an electricfield in the semiconductor substrate in a direction of depth of thesemiconductor substrate and thereby leading photoelectrons entering fromthe light receiving plane of the semiconductor substrate to thephotoelectric converting device formed on a first surface side of thesemiconductor substrate.

With the solid-state image pickup device and the method of fabricatingthe same according to the present invention, the electric fieldgenerating means is provided which generates an electric field in thesemiconductor substrate in the direction of depth of the semiconductorsubstrate and thereby leads photoelectrons entering from the secondsurface (light receiving plane) of the semiconductor substrate to thephotoelectric converting device formed on the first surface side of thesemiconductor substrate. Therefore, even when the photoelectricconverting device and a well region are formed in a shallow region onthe first surface side of the semiconductor substrate, photons enteringfrom the second surface of the semiconductor substrate can beeffectively led to the photoelectric converting device. It is therebypossible to control decrease in sensitivity and color mixing.

Thus, the thickness of the semiconductor substrate does not need tocoincide with the depth of the photoelectric converting device and thewell region, the semiconductor substrate can therefore be formed withproper thickness, and the photoelectric converting device and the wellregion can be formed easily. It is thereby possible to provide a rearsurface incidence type solid-state image pickup device that is simpleand low in cost.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of an outline of a CMOS image sensoraccording to an embodiment of the present invention;

FIG. 2 is an equivalent circuit diagram showing a configuration of apixel of the CMOS image sensor shown in FIG. 1;

FIG. 3 is a schematic plan view of a concrete example of a pixel layoutof the CMOS image sensor shown in FIG. 1;

FIG. 4 is a schematic plan view of a concrete example of a pixel layoutof the CMOS image sensor shown in FIG. 1;

FIG. 5 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to a first embodiment of thepresent invention;

FIG. 6 is a sectional view of an epitaxial substrate used in the CMOSimage sensor shown in FIG. 5;

FIG. 7 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to a second embodiment of thepresent invention;

FIG. 8 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to a third embodiment of thepresent invention;

FIG. 9 is a sectional view of assistance in explaining a method ofmounting the CMOS image sensor shown in FIG. 7 and FIG. 8 in a packageor the like;

FIG. 10 is a sectional view of a desirable mode of a P-type well regionin the CMOS image sensor shown in FIG. 5, FIG. 7, and FIG. 8;

FIG. 11 is a sectional view of a structure of a conventional CMOS imagesensor;

FIG. 12 is a sectional view of a structure of a rear surface incidencetype CMOS image sensor according to a prior application;

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A preferred embodiment of a solid-state image pickup device and a methodof fabricating the same according to the present invention willhereinafter be described.

The solid-state image pickup device according to the present embodimentis a rear surface incidence type CMOS image sensor having a wiring layeron a first surface of a semiconductor substrate (device forming layer)where a photodiode, a reading circuit and the like are disposed, and alight receiving plane in a second surface. In the rear surface incidencetype CMOS image sensor, the photodiode and a P-type well region on theperiphery of the photodiode are disposed in a layer structure that doesnot reach the rear surface (light receiving surface) of the substrate,and an electric field is formed within the substrate to properly leadelectrons entering from the rear surface (light receiving surface) ofthe substrate to the photodiode.

That is, even with the layer structure with a distance between the lightreceiving surface at the rear surface of the substrate and thephotodiode and the P-type well region, the electrons entering from therear surface of the substrate are effectively advanced by leading powerof the electric field within a silicon layer and effectively led to thephotodiode corresponding to an incidence region of each pixel, wherebythe electrons are prevented from being dispersed to adjacent pixels.

Thereby, the need for forming the photodiode and the P-type well regionthat have the same film thickness as the semiconductor substrate can beeliminated. The semiconductor substrate can be formed with adequate filmthickness, and difficulty in manufacturing technology of fabricating anextremely thin semiconductor substrate is eliminated. Also, it sufficesto form the photodiode and the P-type well region in a shallow region ofthe substrate. Thus fabricating operation can be simplified.

As an example of a method of forming an electric field within thesemiconductor substrate, a concentration gradient is provided in advancein a direction of depth of the substrate, whereby an electric field isformed in a fixed manner, or an electrode of negative potential isprovided on the rear surface of the substrate, so that an electric fieldcan be formed through passage of a current.

Further, it is desirable that a region from the rear surface (the lightreceiving surface=the second surface) of the semiconductor substrate to½ or more of the depth of the semiconductor substrate, for example,occur as a region for generating the electric field.

An outline of the CMOS image sensor in the present embodiment will bedescribed.

FIG. 1 is a schematic plan view of an outline of the CMOS image sensoraccording to the embodiment of the present invention. FIG. 2 is anequivalent circuit diagram showing a configuration of a pixel of theCMOS image sensor shown in FIG. 1.

The CMOS image sensor according to the present embodiment includes, on asemiconductor chip 110: an image pickup pixel unit 112; V (Vertical)selection means 114; H(Horizontal) selection means 116; a timinggenerator (TG) 118; an S/H(Sample and Hold) and CDS unit 120; an AGC(Auto Gain Control) unit 122; an A/D (Analog Digital Conversion) unit124; a digital amplifier unit 126; and the like.

The image pickup pixel unit 112 has a large number of pixels arranged ina form of a two-dimensional matrix. As shown in FIG. 2, each of thepixels includes a photodiode (PD) 200 serving as a photoelectricconverting device for generating a signal charge corresponding to anamount of light received and storing the signal charge, and four MOStransistors: a transfer transistor 220 for transferring the signalcharge converted and stored by the photodiode 200 to a floatingdiffusion part (FD part) 210; a reset transistor 230 for resettingvoltage of the FD part 210; an amplifying transistor 240 for outputtingan output signal corresponding to the voltage of the FD part 210; and aselecting (address) transistor 250 for outputting the output signal ofthe amplifying transistor 240 to a vertical signal line 260.

In the pixel having such a configuration, the transfer transistor 220transfers the signal charge obtained by photoelectric conversion by thephotodiode 200 to the FD part 210. The FD part 210 is connected to agate of the amplifying transistor 240. The amplifying transistor 240forms a source follower with a constant-current source 270 providedexternally of the image pickup pixel unit 112. Hence, when the addresstransistor 250 is turned on, a voltage corresponding to the voltage ofthe FD part 210 is outputted to the vertical signal line 260.

The reset transistor 230 resets the voltage of the FD part 210 to afixed voltage (driving voltage Vdd in the example shown in FIG. 2)independent of the signal charge.

The image pickup pixel unit 112 has various driving wiring arranged in ahorizontal direction for driving and controlling the MOS transistors.The V selection means 114 sequentially selects the pixels of the imagepickup pixel unit 112 in a vertical direction in a unit of a horizontalline (pixel row). The MOS transistors of each pixel are controlled byvarious pulse signals from the timing generator 118. Thereby a signal ofeach pixel is output to the S/H and CDS unit 120 through the verticalsignal line 260 in each pixel column.

The S/H and CDS unit 120 is formed by providing an S/H and CDS circuitfor each pixel column of the image pickup pixel unit 112. The S/H andCDS unit 120 subjects the pixel signal outputted from each pixel columnof the image pickup pixel unit 112 to signal processing such as CDS(Correlated Double Sampling) and the like. The H selection means 116outputs the pixel signal from the S/H and CDS unit 120 to the AGC unit122.

The AGC unit 122 effects predetermined gain control on the pixel signalfrom the S/H and CDS unit 120 selected by the H selection means 116, andthen outputs the pixel signal to the A/D unit 124.

The A/D unit 124 converts the pixel signal from the AGC unit 122 from ananalog signal to a digital signal, and then outputs the digital signalto the digital amplifier 126. The digital amplifier 126 performsnecessary amplification and buffering of the digital signal output fromthe A/D unit 124 for output from an external terminal not shown.

The timing generator 118 also supplies various timing signals to partsother than each pixel of the image pickup pixel unit 112 as describedabove.

FIG. 3 and FIG. 4 are schematic plan views of a specific example of apixel layout of the CMOS image sensor according to the presentembodiment. First, FIG. 3 shows an arrangement of photodiodes, activeregions of transistors (regions where gate oxide film is disposed), gateelectrodes (polysilicon films), and contacts therewith. As shown in FIG.3, an active region 300 of each pixel is formed by a rectangular region310 including the photodiode (PD) 200 and the FD part 210 as describedabove, and a bent band-shaped region 320 extending from one corner ofthe rectangular region 310 in a shape of an L.

The FD part 210 in the rectangular region 310 is provided with a contact311. A transfer gate electrode 312 is provided between the photodiode(PD) 200 and the FD part 210, and a contact 313 is provided at an endportion of the transfer gate electrode 312.

A reset gate electrode 321, an amplifying gate electrode 322, and anaddress gate electrode 323 are provided in that order in the bentband-shaped region 320. Contacts 324, 325, and 326 are provided at endportions of the gate electrodes 321, 322, and 323, respectively. Thecontact 311 of the FD part 210 and the contact 325 of the amplifyinggate electrode 322 are connected by metal wiring within the pixel.

A contact 327 connected to the resetting Vdd is provided between thereset gate electrode 321 and the amplifying gate electrode 322. Acontact 328 connected to the vertical signal line 260 is provided at anend portion of the bent band-shaped region 320.

FIG. 4 shows metal wiring in a layer higher than that of FIG. 3 andcontacts therebetween in conjunction with active regions. This examplehas three layers of metal wiring. A first layer is used as intra-pixelwiring 330; a second layer is used as wiring 340 in a verticaldirection; and a third layer is used as wiring 350 in a horizontaldirection.

Conventionally, these pieces of metal wiring 330, 340, and 350 aredisposed so as to avoid the photodiode region. This example greatlydiffers in that the metal wiring is provided also on the upper side(that is, a surface opposite from an incidence plane) of the photodiode.Clearly, with the conventional wiring method in which the wiring avoidsthe photodiode, it is not possible to lay out a pixel of a size as shownin the figures.

The above configuration is common with the prior application describedabove. A configuration of the rear surface incidence type image pickuppixel unit characteristic of the present embodiment will be described inthe following.

A first embodiment of the present invention will be described.

FIG. 5 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to the first embodiment ofthe present invention, showing structure of a photodiode and a transfergate within one pixel 700 of the image pickup pixel unit. In FIG. 5, anupper part is an incidence plane (rear surface) side and a lower part isa wiring plane (front surface) side. FIG. 6 is a sectional view of anexample of an epitaxial substrate used as a semiconductor substrate(device forming layer) in the CMOS image sensor shown in FIG. 5.

As shown in FIG. 5, the CMOS image sensor in this example has a wiringlayer 720 formed on a surface of an epitaxial substrate 710. Within thewiring layer 720, various wiring 721 formed by multilayerinterconnection, a gate electrode 722 of a transfer transistor and thelike are provided with an intermediate insulating layer.

A silicon oxide film (SiO2) 730 is formed on the rear surface of theepitaxial substrate 710 to form a light incidence plane. Though omittedin FIG. 5, a light shield film, a color filter, a microlens and the likeare provided in a layer over the silicon oxide film 730.

A P-type well region 740 as a device forming region is formed in ashallow region on the front surface side of the epitaxial substrate 710.The P-type well region 740 includes an n-type region 750 as aphotoelectric converting region of the photodiode and an n+ type region760 of an FD part. The gate electrode 722 of the transfer transistoroperates to output signal charge accumulated in the n-type region 750 ofthe photodiode to the n+ type region 760 of the FD part.

As shown in FIG. 5, the n-type region 750 of the photodiode and the n+type region 760 of the FD part are formed in the shallow region from thefront surface side of the epitaxial substrate 710. The P-type wellregion 740 is removed in a lower region (a region on the rear surfaceside) that extends from the n-type region 750 of the photodiode to then+ type region 760 of the FD part. A P-type epitaxial layer of theepitaxial substrate 710 is disposed in the portion of the lower region(therefore, in the section shown in FIG. 5, the P-type well region 740is formed as two separate P-type well regions 740A and 740B).

The epitaxial substrate 710 has an epitaxial layer of a relativelyhigh-concentration P+ type in a deep region (a region on the rearsurface side) of the substrate 710 and of a relatively low-concentrationP-type in a shallow region (a region in the vicinity of the photodiodeon the front surface side) of the substrate 710 as a result ofadjustment of impurity concentration by ion implantation or the like.

Thus in this example, a concentration gradient (from the P+ type to theP-type) is provided in advance in a direction of depth of the epitaxialsubstrate 710, whereby an electric field is formed in a fixed manner.

A method of fabricating the device structure shown in FIG. 5 will nextbe described with reference to FIG. 6. It is to be noted that theepitaxial substrate 710 in FIG. 5 is turned upside down in FIG. 6.

First, a P-type epitaxial layer 711 is grown on a surface of a substratematerial 770 such as a P-type semiconductor substrate or the like. TheP-type epitaxial layer 711 is formed such that the impurityconcentration thereof is lowered with upward approach (to the surface)in FIG. 6. Incidentally, any material may be used as the substratematerial 770 as long as the substrate material 770 allows epitaxialgrowth.

Using such a substrate (the composite substrate of the substratematerial 770 and the P-type epitaxial layer 711), each device such asthe transistor, the photodiode, the wiring or the like is created in thesurface of the P-type epitaxial layer 711. Thereafter, the substrate isturned upside down, the substrate material 770 side is ground to removethe substrate material 770, and further the P-type epitaxial layer 711is polished to a predetermined film thickness, whereby theabove-described epitaxial substrate 710 is formed. Then, the siliconoxide film 730 is formed on the rear surface of the epitaxial substrate710, and further the light shield film, the color filter, the microlensand the like are provided.

The first embodiment as described above eliminates the need forfabricating a deep P-type well region 740 in the image pickup pixelunit, and thus makes the fabrication easier. The first embodiment hasanother advantage in that identical well regions can be used as theP-type well region of the image pickup pixel unit and a P-type wellregion of a peripheral circuit unit.

Specifically, in this example, an electric field is generated within theP-type epitaxial substrate 710 due to a concentration differencethereof, whereby the electric field leads an electron (indicated as anelectron 780 in FIG. 5) generated by photoelectric conversion ofincident light in the P-type epitaxial substrate 710 to the photodiode(PD) side. Hence, even with the shallow P-type well region, it ispossible to prevent the electron from entering adjacent pixels.

Incidentally, a hole generated by the photoelectric conversion inconjunction with the electron is led to the rear surface side by theelectric field. Holes as a whole are maintained in a uniform state atall times as a result of diffusion between the rear surface and theP-type well region.

In this case, the epitaxial layer is made to change from the P+ type onthe rear surface side to the P-type; however, other gradients may beused as long as the impurity distribution causes an electric field inthe same direction within the epitaxial layer. For example, a P-type toI (=intrinsic)-type distribution, a P-type to N-type distribution, or anI-type to N-type distribution may be used. Also, while in this case, thesubstrate material 770 is ground to be removed completely, the substratematerial 770 does not necessarily need to be removed when the substratematerial 770 sufficiently transmits light of waveforms of interest.

A second embodiment of the present invention will next be described.FIG. 7 is a sectional view of a device structure in a rear surfaceincidence type CMOS image sensor according to the second embodiment ofthe present invention, showing structure of a photodiode and a transfergate within one pixel 700 of an image pickup pixel unit. In FIG. 7, anupper part is an incidence plane (rear surface) side and a lower part isa wiring plane (front surface) side. Components common with FIG. 5 areidentified by the same reference numerals, and description thereof willbe omitted.

As shown in FIG. 7, the CMOS image sensor in this example is providedwith an electrode 810 on the rear surface of a substrate 800 in which aphotodiode and a P-type well region are created. An electric field isgenerated within the substrate 800 by sending a current from a powersupply 820 to the electrode 810.

In the example shown in FIG. 7, a transparent electrode 810 of ITO(indium-tin oxide) or the like is used. The transparent electrode 810 isdisposed in a light receiving region of the substrate 800 and suppliedwith a minus voltage relative to the P-type well region 740.

Thereby an electric field in a direction in which photoelectrons driftto the photodiode is generated, thus making it difficult for thephotoelectrons to enter adjacent pixels. Hence a shallow P-type wellregion 740 is allowed to be formed. Incidentally, holes generated by thephotoelectric conversion in conjunction with the electrons are driftedto the transparent electrode 810 side and absorbed.

In this example, it is desirable to use a high-resistance substrateclose to an intrinsic semiconductor for the substrate 800. This makes itpossible to sufficiently reduce a current flowing from the P-type wellregion 740 and the like to the transparent electrode 810 on the rearsurface. Specifically, a substrate with a difference between a donor andan acceptor concentration of 1013 cm-3 or less is desirable (of coursethis includes the intrinsic semiconductor). However, this indicates asubstrate of a concentration now scarcely used in semiconductor ICs.

It is also desirable to dispose an electron injection preventing film821 between the transparent electrode 810 and the substrate 800 in orderto prevent electrons from being injected from the transparent electrode810 into the substrate 800. Incidentally, as the electron injectionpreventing film 821, a shallow P+ layer may be formed, or asemiconductor layer of amorphous silicon carbide or the like with alarge band gap may be formed.

When the electron injection preventing film 821 is provided, an n-typehigh-resistance substrate may be used. Specifically, a substrate with adonor concentration of 1015 cm-3 or less is desirable. However, thisconcentration indicates a low level scarcely used in currentsemiconductor ICs. Further, even without such an electron injectionpreventing film 821, it suffices for the transparent electrode itself tohave a work function on the P side.

A third embodiment of the present invention will next be described. FIG.8 is a sectional view of a device structure in a rear surface incidencetype CMOS image sensor according to the third embodiment of the presentinvention, showing structure of a photodiode and a transfer gate withinone pixel 700 of an image pickup pixel unit. In FIG. 8, an upper part isan incidence plane (rear surface) side and a lower part is a wiringplane (front surface) side. Components common with FIG. 5 and FIG. 7 areidentified by the same reference numerals, and description thereof willbe omitted.

As shown in FIG. 8, the CMOS image sensor in this example is providedwith a metal electrode 840 of Al or the like on the rear surface of asubstrate 800 in which a photodiode and a P-type well region arecreated, with an insulative protecting film 830 intermediate between thesubstrate 800 and the metal electrode 840. An electric field isgenerated within the substrate 800 by sending a current from a powersupply 820 to the metal electrode 840.

The metal electrode 840 is disposed so as to avoid a light receivingregion in the substrate 800, and surrounded by the insulative protectingfilm 830 and an upper insulating film 850. A color filter 860 and amicrolens 870 are disposed on the upper insulating film 850.

Thereby an electric field in a direction in which electrons drift to thephotodiode is generated, thus making it difficult for the photoelectronsto enter adjacent pixels. Hence a shallow P-type well region 740 isallowed to be formed. Incidentally, holes generated by the photoelectricconversion in conjunction with the electrons are drifted to the metalelectrode 840 side and absorbed.

In this example, since the metal electrode 840 is disposed so as toavoid the light receiving region, the metal electrode 840 can also beused as light shield film for blocking light passing through an edgeportion of the color filter formed for each pixel and for providing apixel in which the whole of the light receiving region is intentionallyshielded from light to detect a black level.

FIG. 8 shows the color filter 860 and the microlens 870 to clearlyillustrate the arrangement of the metal electrode 840; the structureitself of the color filter 860 and the microlens 870 is not particularlydifferent from that of the foregoing examples.

Also in this example, it is desirable to use a high-resistance substrateor an n-substrate as the substrate for the same reasons as describedabove. It is also desirable to provide an electron injection preventingfilm (insulative protecting film 830) between the electrode 840 on therear surface and the substrate 800. Incidentally, the electron injectionpreventing film is described as the insulative protecting film 830because the electron injection preventing film also functions as aprotecting film when the electrode on the rear surface is etched.

A method of mounting the solid-state image pickup device in this examplewill next be described. Since the electrode is provided on the rearsurface of the substrate in the foregoing examples of FIG. 7 and FIG. 8,the method of mounting the solid-state image pickup device in a packageor the like provides a structure as shown in FIG. 9.

Specifically, the solid-state image pickup device 900 shown in FIG. 9provided with a main device unit (the semiconductor substrate and thewiring layer portion) 920 as shown in FIG. 7 or FIG. 8 on a substratesupporting material 910 is flip-chip-mounted on a bottom board of thepackage or a circuit board 970.

A rear-surface electrode 950 as described above is provided on top (rearsurface side) of the main device unit 920, and a color filter 930 and amicrolens 940 are provided on top of the rear-surface electrode 950.Incidentally, though not shown, a lens barrel is mounted such that thelens is situated over such a mounted structure.

As in the foregoing solid-state image pickup device of the priorapplication (FIG. 12), the substrate supporting material 910 is providedon the front surface of the substrate so as to maintain a certain degreeof strength even when the substrate is thinned by polishing the rearsurface thereof. The main device unit 920 is connected to the bottomboard of the package or the circuit board 970 by contact wiring 911provided within the substrate supporting material 910. The rear-surfaceelectrode 950 is connected to the bottom board of the package or thecircuit board 970 via wire bonding 960.

Desirable forms of the P-type well region in the solid-state imagepickup device in this example will next be described. In both of theforegoing examples of FIG. 7 and FIG. 8, the electric field in thedirection in which electrons drift to the photodiode (PD) is formedwithin the semiconductor substrate.

As a desirable mode of the P-type well region 740 common to theseexamples, there is a form as shown in FIG. 10, for example.Specifically, the P-type well region is not formed at the photodiode(PD; n-type region 750), and an opening 741A and 741B of the P-type wellregions 740A and 740B on both sides is made larger at a part nearer tothe rear surface. Thereby an electric field is formed so as tofacilitate flow of electrons into the photodiode.

As a method of creating such a shape of the P-type well region, when theP-type well region is formed by implanting ions to different depths by aplurality of ion implantations, for example, a method of performing ionimplantation to a deep portion in a separate step using a separate maskcan be used.

Further, as another desirable mode, reflection preventing film isattached to an upper and a lower surface and sides of the wiring toprevent irregular light reflection, or a material with a high lightabsorptance is used in the substrate supporting material and the bottomboard of the package or the circuit board.

As described above, with the solid-state image pickup device accordingto the embodiments, in the rear surface incidence type CMOS imagesensor, an electric field leading electrons to the photodiode side isformed in the semiconductor substrate part. It is therefore possible toprovide an excellent solid-state image pickup device with a little colormixing and a little decrease in resolution without forming the P-typewell region deep enough to reach the rear surface.

Thus, a difficult production process such as reducing the semiconductorsubstrate part to a very small thickness equal to the depth of theP-type well region is not required, and hence stable fabrication can berealized. Further, even when the pixel is made smaller, the photodiodedoes not need to be made very long and narrow in the direction of depththereof. It is therefore not necessary to reduce the thickness of thesemiconductor substrate part in correspondence with the smaller pixel.Thus, reduction in size of the pixel can be promoted without problems,and reduction in size of the chip can also be realized.

It is to be noted that while in the foregoing embodiments, thesolid-state image pickup device as a separate unit has been described,such a solid-state image pickup device can be incorporated into variouselectronic apparatus such as various digital camera apparatus, andportable telephones and various other communication apparatus tocontribute to reduction in size and increase in performance of theelectronic apparatus, and therefore the present invention covers suchelectronic apparatus.

As described above, with the solid-state image pickup device and themethod of fabricating the same according to the present invention,electric field generating means is provided which generates an electricfield in the semiconductor substrate in the direction of depth of thesemiconductor substrate and thereby leads photoelectrons entering fromthe second surface (light receiving plane) of the semiconductorsubstrate to the photoelectric converting device formed on the firstsurface side of the semiconductor substrate. Therefore, even when thephotoelectric converting device and the well region are formed in ashallow region on the first surface side of the semiconductor substrate,photons entering from the second surface of the semiconductor substratecan be effectively led to the photoelectric converting device. It isthereby possible to control decrease in sensitivity and color mixing.

Thus, the thickness of the semiconductor substrate does not need tocoincide with the depth of the photoelectric converting device and thewell region, the semiconductor substrate can therefore be formed withproper thickness, and the photoelectric converting device and the wellregion can be formed easily. It is thereby possible to provide a rearsurface incidence type solid-state image pickup device that is simple,low in cost, and excellent in picture quality.

Further, by incorporating such a solid-state image pickup device into anelectronic apparatus, the electronic apparatus can be reduced in size.

1.-35. (canceled)
 36. A solid-state image pickup device comprising: a semiconductor substrate including a first conductive type photoelectric converting device, a well region of a second conductive type which is opposite the first conductive type located around the photoelectric converting device and a reading circuit; a wiring layer formed by stacking a plurality of layers of wiring including a signal line for driving said photoelectric converting device adjacent a first surface of said semiconductor substrate, a second surface of said semiconductor substrate being a light receiving plane for said photoelectric converting device; and an electric field generating means for generating an electric field in said semiconductor substrate in a direction of depth of said semiconductor substrate and thereby leading photoelectrons in said photoelectric converting device from said second surface side to said first surface side of said photoelectric converting device, and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate.
 37. A solid-state image pickup device as claimed in claim 36, characterized in that: said photoelectric converting device is a photodiode and said well region is a P-type well region.
 38. A solid-state image pickup device comprising: a semiconductor substrate including an image pickup pixel unit having a plurality of pixels each including a photoelectric converting device and a reading circuit in a two-dimensional array; a wiring layer formed by stacking a plurality of layers of wiring including a signal line for driving said image pickup pixel unit adjacent a first surface of said semiconductor substrate, a second surface of said semiconductor substrate being a light receiving plane for said photoelectric converting device; and an electric field generating means for generating an electric field in said semiconductor substrate in a direction of depth of said semiconductor substrate and thereby leading photoelectrons in said photoelectric converting device from said second surface side to said first surface side entering from the light receiving plane of said semiconductor substrate to the photoelectric converting device, and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate characterized in that: said electric field generating means generates the electric field in the direction of the depth of said semiconductor substrate in a region having ½ or more of the depth of said semiconductor substrate from the second surface of said semiconductor substrate.
 39. A method of fabricating a solid-state image pickup device, said solid-state image pickup device comprising: providing a semiconductor substrate having an image pickup pixel unit having a plurality of pixels each including a first conductive type photoelectric converting device, a well region of a second conductive type which is opposite the first conductive type located around the photoelectric converting device and a reading circuit; forming a wiring layer by stacking a plurality of layers of wiring including a signal line for driving said image pickup pixel unit adjacent a first surface of said semiconductor substrate, a second surface of said semiconductor substrate being a light receiving plane for said photoelectric converting device; providing an electric field generating means for generating an electric field in said semiconductor substrate in a direction of depth of said semiconductor and thereby leading photoelectrons in said photoelectric converting device from said second surface side to said first surface side and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate; and characterized in that: said photoelectric converting device is a photodiode and said well region is a P-type well region.
 40. A method of fabricating a solid-state image pickup device, said solid-state image pickup device comprising: providing a semiconductor substrate having an image pickup pixel unit having a plurality of pixels each including a photoelectric converting device and a reading circuit in a two-dimensional array; forming a wiring layer by stacking a plurality of layers of wiring including a signal line for driving said image pickup pixel unit over a first surface of said semiconductor substrate, a second surface of said semiconductor substrate being a light receiving plane for said photoelectric converting device; providing an electric field generating means for generating an electric field in said semiconductor substrate in a direction of depth of said semiconductor substrate such that said electric field leads photoelectrons from the light receiving plane side of said semiconductor substrate to the photoelectric converting device, and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate; and characterized in that: said electric field generating means generates the electric field in the direction of the depth of said semiconductor substrate in a region having ½ or more of the depth of said semiconductor substrate from the second surface of said semiconductor substrate.
 41. An electronic apparatus having a solid-state image pickup device, said solid-state image pickup device comprising: a semiconductor substrate having an image pickup pixel unit with a plurality of pixels each including a first conductivity type photoelectric converting device, a well region of a second conductive type which is opposite the first conductive type located around the photoelectric converting device and a reading circuit; and a wiring layer formed by stacking a plurality of layers of wiring including a signal line for driving said image pickup pixel unit adjacent a first surface of said semiconductor substrate, a second surface of said semiconductor substrate being a light receiving plane for said photoelectric converting device, said electronic apparatus characterized in that: said solid-state image pickup device has an electric field generating means for generating an electric field in said semiconductor substrate in a direction of depth of said semiconductor substrate and thereby leading photoelectrons in said photoelectric converting device from said second surface side to said first surface side, and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate; and characterized in that: said electric field generating means generates the electric field in the direction of the depth of said semiconductor substrate in a region having ½ of the depth of said semiconductor substrate from the second surface of said semiconductor substrate.
 42. An imaging device comprising: a substrate having a first and a second surface; a transistor formed on said first surface; a first conductivity type light-electricity conversion region formed at said first surface and a second conductivity type well region located around the light-electricity conversion region; an insulating layer formed above said second surface; wherein said substrate has a drift region which has non-uniform impurity distribution and is formed below said light-electricity conversion region, further comprising a transparent electrode, and further comprising a SiO₂ film formed over said second surface of said semiconductor substrate. 